MINIMUM QUALIFICATIONS:

• Master’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferred
• Six years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in Process Development
• Experience working in a wafer fab manufacturing environment
• Experience with Statistical Process Control (SPC)
• Proficient in the use of Microsoft Office Applications

• Knowledge of semiconductor or HDD industry principles, practices, and techniques
• Knowledge of wafer fabrication processing techniques, including process development and integration practices
• Knowledge of TMR and PMR processes and applications
• Knowledge of wafer manufacturing principles, processes, and equipment
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual base salary for this full-time position is between $111,276.05-$163,641.25 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Sr. Photolithography Process Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.

• Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

Job Snapshot