Job description

Product Engineer

Hisense Photonics Inc. is a hightech chip design and manufacturing company in South Plainfield, NJ. We offer a full portfolio of semiconductor laser products utilizing inhouse FP, DFB, EML, Tunable DBR, Tunable EML, and
SOA based integrated chips, reaching speeds up to 25/56 Gps. We have fully integrated manufacturing model that enhances product reliability, manufacturability and performance, and control all phases of the development and manufacturing process inhouse, spanning from device design & simulation to MOCVD epitaxy, full IIIV wafer processing lines, and highly automated packaging techniques and a robust final testing platform.

As a Product Engineer, you will play a crucial role to work with crossfunctional teams including process & Epi engineering, and manufacture & test team, operations & planning etc., and drive yield improvement to sustain production. You will support ongoing production of semiconductor lasers, and also work closely with R&D team on new product introduction for the nextgeneration semiconductor lasers.

Responsibility

• Perform correlation study between semiconductor laser characteristic parameters, epitaxial material properties, and analysis on critical waferfab steps to enhance improvements on design, epitaxy and processing for manufacturability;
• Conduct detailed characterization and failure analysis of lasers to drive continuous improvement efforts;
• Lead crossfunctional team to drive yield improvement; coordinate with process & Epi engineering, and manufacture & test team to ensure implementation of actions on improvements per data analysis;
• Work closely with R&D team to support new product introduction;
• Coordinate correlation study between chip, optical subassembly and modules for chip improvements; work closely with them to address chip related issues;
• Support production such as solving waferinprocess issues, performing failure analysis during wafer manufacture and bar/COC testing;
• Define EPI/process spec limits;
• Perform root cause analysis for yield excursions;
• Conduct cost modeling to assist decisions on designing costcompetitive products.

Job Qualifications

• MSc or Ph. D. degree in Physics, Material Science, or Electronic Engineering, or related field;
• Knowledge of compound IIIV semiconductor and device physics;
• Experience in semiconductor laser device design, processing and testing experience;
• Handson experience in the area of semiconductor laser diode fabrication in a cleanroom;
• Strong analytical and problemsolving ability; appreciation of both practical and theoretical methodologies;
• Statistical data analysis skills (JMP) is preferred;
• Selfmotivated and strong team player with good communications skills; ability to drive actions and solutions through crossfunctional teams.

Job Type: Fulltime

Job Location: South Plainfield, NJ

Job Type: Full-time

Pay: $80,000.00 - $100,000.00 per year

Benefits:

• 401(k)
• Dental insurance
• Health insurance
• Paid time off
• Vision insurance

Schedule:

• 8 hour shift

Supplemental pay types:

• Bonus pay

Work Location: Multiple Locations

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