SKILL: As a highly skilled specialist, contributes to the development of concepts and techniques. Completes complex tasks in creative and effective ways.

JOB COMPLEXITY: Consistently works on complex assignments requiring independent action and a high degree of initiative to resolve issues. Makes recommendations for new procedures.

SUPERVISION: Acts independently to determine methods and procedures on new assignments. Often leads or supervises the activities of other nonexempt personnel.

EXPERIENCE: Typically requires a minimum of 6+ years of related experience.

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  Develop and improve wafer fab processes such as Dry Etch, Wet Etch, Bonding, Plating, Photolithography…
• Use and run wafer metrology tools to analyze problems, failures and other technical issues.
• Set technical direction with respect to toolset and process technology.
• Use good problem solving and project management skills to solve a wide array of technical product problems.
• Manage the automation of current and new manufacturing processes, including Automation Host, Factory Data & Classification, Web RCT and MES systems…
• Work closely with development engineering and manufacturing to drive process improvements for Wafer Fab Operations for improvement in yield, output, cost and safety.
• Participate with manufacturing, process development, facilities, quality assurance in developing requirements and recommendations for system modifications.
• Coordinate portions of the work of consultants and engineering firms on development of standard design documents.
• Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.
• Facilitate problem solving and brainstorming activities and participate in and supports cross-functional teams.

• Associate degree in Engineering, Material Science, Physics or equivalent experience.
• 2 to 8 or more years related experience.
• Must have the ability to manage multiple priorities, working in a fast-paced environment.
• Organizational skills to track and coordinate multiple concurrent projects
• Self-starter who is able to work independently as well as part of a team.
• Proven capability in complex technical problem solving.
• Excellent attention to detail.
• Ability to interact with senior internal and external personnel.
• Good written and oral communication skills for spec writing, pass down, and instructions to operators.
• Ability to define problems, collect data, establish facts, and draw valid conclusions.
• Ability to interpret an extensive variety of technical instructions in mathematical or diagram form and deal with several abstract and concrete variables.
• Ability to understand and interpret pertinent policies clearly and accurately.
• Must be able to be trained in proper handling of chemicals and hazardous waste.

• Experience with MEMS.

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  Standing or walking over two-thirds of the time.
• Perform manual processing of wafers using chemicals to clean and etch wafers requiring frequent use of arm and wrist movements.
• May be required to use microscopes for long periods of time to perform wafer and die level inspections.

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  Clean room environment – must be able to wear full clean room garments.
• Exposure to moderate noise levels.
• Exposure to stored energy hazards (electricity, compressed gases, etc.)
• May be required to use microscopes for extended periods of time.
• Exposure to chemicals needed for processing wafers- such as alcohol, acetone, acids, solvents and photo resist.
• Works in a facility that houses hazardous chemicals.

• Other duties as may be assigned.
• Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.
• Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects of these documents.